개발이력

12

• Solder Cutter

07

• EtherCAT 박스 PC E-Quve

04

• EtherCAT Master

03

• Die Bonder In Line (Loader, Unloader, Conveyor)

07

• DeviceNet Master

05

• Flip Bonder (AB-6500F)

08

• 산업용 박스 PC Quve

01

• AMX Motion Controller

12

• IBB Tray Sorter

10

• NittoTape In Line

08

• Minami SBA Loader
• Parmi AOI In Line

06

• Jig System In Line

05

• Shinkawa TC In Line

07

• Yamaha FCM In Line

01

• Dual Jig Loader and Unloader

11

• SIP In Line

05

• Ultrasonic Wire Cutter
• Jig Magazine Loader

03

• Thermo Compression Bonder

02

• Flip Bonder for Multi Wafer

11

• Package Inspector

04

• Flip Bonder(AB-6200F)

11

• Samsung Partner Company

05

• FCM Dual Lane (Laser Marker, Buffer, Array)

04

• FCM In Line (Loader, Buffer, Unloader)

03

• Flip Bonder (AB-6100F)

02

• Jig Loader and Unloader

06

• Inspector for TSV

02

• COG Bonder (AB-8000F)

08

• Multi Loader, Buffer, Unloader

07

• PCB Loader and Inspector for Solder Ball Attach
• Ultrasonic Flip Bonder (AB-6000F)

03

• PCB Loader and Unloader (OHT)

01

• Ultrasonic Flip Bonder (AB-4600F)

02

• Laser Marker and PCB Array

08

• Ultrasonic Seam Sealer

04

• PCB Unloader (ASU-8000)

07

• PCB Loader, Unloader (A series)

08

• Ultrasonic Flip Bonder (AB-4500F)

07

• PCB Loader and Unloader (AH series) in Samsung

03

• Wafer Synthesizer for Samsung in Bio Application

01

• ISO9001/14001

09

• W/B Handler for LED Package

02

• EMS Business

09

• Peptide Synthesizer

01

• Bio Equipment

01

• Chip Mounter Controller for Samsung Techwin

12

• Motor Controller

06

• Establishment of Amess